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PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC Fast USB 3

USD45.55 USD83.55

Pay in 4 interest-free payments of $11.39 Learn more

4.8 SKU 62098527524

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 7 - Sep 12

Assay notes
Description

Fast USB 3

china phone SK Hynix

IC component layout diagrams

aviation and space industries

3% of reading+10mA)

PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering Size:120CC Fast USB 3PHONEFIX Heating Station + 3 kinds Motherboard Heating groove Features : Brand: PHONEFIX Voltage: 110V 220V Demolition shield temperature adjustment 180 220 In addition to CPU side glue temperature 180 220 Demolition A8 A9 A10 A11CPU the temperature 230 240 Desmearing temperature 180 200 Reballing BGA chip temperature 180 200 Soldering A8 A9 A10 A11 CPU temperature 190 210 Optional Types : 120X MAX ( 3 IN 1 ) for iPhone X XS XS MAX Double Layers Board

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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