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Amaoe 31 IN 1 Middle Layer Reballing Stencil Kits for iPhone X-17 Series PHONEFIX Interpupillary Distance: 2-3/16" - 2-15/16"(

USD55.99 USD81.99

Pay in 4 interest-free payments of $14.00 Learn more

4.1 SKU 60386315665

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 8 - Sep 13

Assay notes
Description

Interpupillary Distance: 2-3/16" - 2-15/16"( 55-75mm )

the clamp can not only fix the motherboard but also the CPU/hard drive and other precision ICs without glue

Temperature controlling range 80-500℃

put the motherboard into the baseband chip reading and writing area

Equipment size: 588

Amaoe 31 IN 1 Middle Layer Reballing Stencil Kits for iPhone X-17 Series PHONEFIX Interpupillary Distance: 2-3/16" - 2-15/16"(Amaoe 31 in 1 X 17 middle layer reballing platform with mid frame stencil steel mesh for iPhone X 17 Pro Max motherboard layering soldering repair. Amaoe iPhone motherboard middle layer frame tin planting station for iPhone X 11 12 13 14 15 16 17 Pro Max. Option(0. 12mm): 1. 31 in 1 set: 31 IN 1 middle layer reballing platform for iPhone X 17 Pro Max (not include the iPhone 16e 17air). 2. 6 in 1 set: 6 in 1 middle layer reballing platform for iPhone X

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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