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Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 153444677213 The wear is only physical

USD4749.99 USD4787.99

Pay in 4 interest-free payments of $1187.50 Learn more

4.4 SKU 54785459072

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 8 - Sep 13

Assay notes
Description

The wear is only physical and does not affect the functionality of the Communications Analyzer

lamp lens cover

Manufacturer UVEXS Part Number SCU 110B Model Number 13197B SKU 19-59459 Ref 23-84673

New in boxes

Manufacturer Continuum Model Number MiniLite SKU 19-60573 Ref 23-84381

Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 153444677213 The wear is only physicalThis item will ship motor freight. Condition Used Description Includes: Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System Omega DPi8 2x 8601 052 REV D Schott Fostec 20500 3x Panasonic GP KR222 Leica MZ95 Optem Controller A. G. Heinze DL 150 Gast DOA P704 AA Sylvania display Optem Stepping Motor Junction Box 30 17 74 Ushio 21V150W Halogen Reflector Lamp RadioShack 15 1982 Video Selector Dell Keyboard Viteris SPR Push

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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