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Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Option:Mbga/MFix-UBase base The extended platform is 330mm*200mm

USD49.99 USD97.99

Pay in 4 interest-free payments of $12.50 Learn more

4.8 SKU 43219725569

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 8 - Sep 13

Assay notes
Description

The extended platform is 330mm*200mm

All kinds of mobile phone motherboard SMT IC and LED lights

Qianli 3 IN 1 Pre-Heating Desoldering Platform for iPhone X XS MAX PCB -110V/220V

Vacuum pressure(max): 280mmHg

compatible for Macbook Air A1466 A1465

Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Option:Mbga/MFix-UBase base The extended platform is 330mm*200mmAMAOE Mbga IP WiFi Baseband CPU NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7 15 Pro Max. Mbga IP 26 in 1 BGA reballing stencil platform for Planting tin & Degumming CPU, hard drive, WIFI, baseband welding Repair. Option: Mbga IP 26 in 1 set ( 7 15PM) Mbga IP 14 14P kit Positioning plate Mbga IP 12 13 kit Positioning plate Mbga IP XS 11 kit Positioning plate Mbga IP 7 8 X Qualcomm kit Positioning plate Mbga IP 7 8 X Intel

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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