WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscope (Steps 1 - 2 -

(Steps 1 - 2 - 5)

PPD 120CXE Mini Intelligent Desoldering Rework Station for Remove Welding iPhone X CPU Repair

Effective Soldering max area: 300 x 320mm

Intelligent SP001 Parameters:

Simple per-partition operations (Read

WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscope (Steps 1 - 2 -Optical alignment system BGA rework station WDS 700. WDS 700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after sales service and rework. How to separate BGA chip from motherboard How to replace a new BGA chip Repair steps : Separate the BGA chip from mother board we called desoldering Clean Pad Reballing or replace a new BGA chip directly